Circuposit™ 3000-1 from Dupont Dow Rhom Hass Company

Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
 

Key Properties

• Exceptional Interconnect Reliability
• Horizontal or vertical application
• Excellent bath stability and performance
• Reduced bath maintenance
• Reduction in solution volume growth
• Low-build or high-build deposition
   

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2021年度(du)填孔(kong)鍍銅(tong)——印刷(shua)線路(lu)闆（PCB，FPC）酸(suan)性填(tian)孔鍍(du)銅中(zhong)間體(ti)： benxiaohai.cc/news/283.html

 

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