Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
Key Properties
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Exceptional Interconnect Reliability
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Horizontal or vertical application
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Excellent bath stability and performance
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Reduced bath maintenance
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Reduction in solution volume growth
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Low-build or high-build deposition
酸性鍍(du)銅中間體(tǐ)相關鏈接(jie)：
垂直連續(xu)電鍍（VCP）高TP值(zhi)酸性鍍銅(tóng)光澤劑用(yòng)電鍍中間(jian)體：
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PCB/FPC用高TP值(zhí)VCP酸性鍍銅(tong)光亮劑中(zhong)間體産品(pin)介紹：
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2021年度(dù)填孔鍍銅(tong)——印刷線路(lu)闆（PCB，FPC）酸性填(tián)孔鍍銅中(zhōng)間體：
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2021年國(guo)際表面處(chù)理展電子(zǐ)展廳：
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