新(xin)材料科(ke)技與化(huà)學技術(shù)創新
Copper Gleam™ HV-101 & HV-606 Electrolytic Copper
2025-12-24 09:44
The Copper Gleam™ HV-606 bath has been developed to work with insoluble anodes to deliver high plating performance at high current densities.
- Excellent throwing power on through-holes and microvias
- Exceptional panel plating distribution
- Exceptional leveling performance on panel surface and inside through holes
- Good thermal reliability
Excellent Throwing Power
Exceptional levelling
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