Microfill™ LVF 3 Acid Copper from Dupont Dow Rhom Hass Company

Microfill™ LVF 3 Acid Copper is designed to offer exceptional blind microvia filling performance, and is specifically formulated for use with insoluble anodes and direct current (DC) rectification. Formulated to operate over a broad range of operating conditions, the bath offers end users with outstanding production flexibility in either panel or pattern plate operation.
 

Advantages:

• Excellent blind microvia fill with lower copper surface thickness
• Bright, highly ductile, leveled deposit
• DC process with insoluble anodes for simple operation
• Easily analyzed and controlled by conventional CVS
• Designed for use in both pattern and panel plate applications
• Tunable process for specific end user requirements
   

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Read Technology for Through Hole Filling 
Microfill™ THF Electrolytic Copper
 

Dielectric thickness: 110 µm
Plating thickness: 12 µm

 

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